Implementation - Printed Circuit Board Assembly
Since we are developing in-house, we can maintain high-quality product manufacturing.
We are operating two lines each for surface mount and discrete components, separating the leaded solder process from the RoHS-compliant solder process, and managing production accordingly. We have database records of metal mask shapes and profiles, allowing us to propose optimal component placements that meet our customers' needs. We also accommodate high-density components such as BGA and LGA, and conduct X-ray inspections. We have obtained ISO 9001 certification (acquired in 2000 and transitioned to the 2008 version) and have established a quality system based on internal standards and a quality manual. We strive to improve quality management, from reflow and flow management to hand soldering operations through operator training. In the current PCB manufacturing environment, where the precision of manufacturing machines is a crucial factor, we implement thorough maintenance management. Additionally, we develop electrical testing jigs in-house, considering product performance and productivity, which enables us to maintain high-quality product manufacturing.
- Company：エポックサイエンス
- Price：Other
